Propagation Delay on Signals
PCB layout

by Douglas Brooks

T he interconnect delay (propagation time along a trace) is sometimes more important than the signal propagation time through individual components. Standard reference sources (Motorola's MECL System Design Handbook, for example1) give several formulas that relate to the propagation delay of a signal along a trace on a circuit board. These formulas have been combined and summarized in Figure 1. The first part of the formula provides the basic propagation time under unloaded conditions. In that formula, a = 1, b = 0 for stripline configurations and a = 0.475, b = 0.67 for microstrip.

Figure 1-Formula for propagation delay along a trace.

The second part of the formula incorporates the slowing of signals due to the capacitive loading along the line. This capacitive loading is caused by circuit loads on the line and stray, parasitic capacitances.

People tend to use 2 nsec./ft. as a standard rule of thumb for propagation delay when designing circuits. However, this figure might be off by as much as 50%, depending on design specifics.

The first important variable in this equation is er, the relative dielectric coefficient. A value of 4.2 for standard FR-4 board material is often used. Actual values can easily range from 4.0 to 4.4 (or more) in the real world, and er even varies within a layer as a result of temperature and pressure effects during fabrication. This range results in an uncertainty of tpd of approximately 5%, or about 0.1 nsec./ft. That's 8.3 psec./in., or 100 psec. in a 12-inch line.

The second important factor is Cd, the sum of the capacitance effects of the loads on the line. A fanout of eight loads of about 5 picoferads each on a 12-inch line can slow tpd by as much as 50% (1 nsec./ft. or 83 psec./in). The calculation of the exact amount requires a calculation of Co, which depends on er and the board interlayer geometries.

The bottom line is that before the delay along a line can be adjusted accurately to meet circuit needs, the actual tpd along the line must be known. The actual tpd depends, among other things, on the design that is created (the path lengths) and the fabrication processes that are used.

My company can trim a line length as close as 1 mil, which is within a fraction of a picosecond. Since, in practice, the uncertainty of tpd is as much as 80 psec. in an inch, design tolerances can be almost two orders of magnitude tighter than other sources of uncertainty!

So, what does the circuit design engineer do? First, understand the limitations of accurately estimating tpd before adjusting signal delay times by adjusting line lengths. Then, work closely with your board house. I have found that only a small fraction of board shops really understand these concepts and their processes well enough to help their customers meet very tight requirements.

Limits on Adjustments

There is a lower limit on propagation time. It's hard to make a trace shorter than the straight line connecting two points! But, you can add time to a trace by increasing its length. Up to available surface area, no limit exists on how much time may be added.

My company can adjust an individual line (or match a differential pair of lines) as close as 1 mil (0.001) without much difficulty, which is about 0.2 psec. Although we can adjust lengths even tighter than this, the benefits are seldom worth the effort.

Figure 2-- Alternative ways to route traces to add propagation time to a line.

How To Route Trace Lengths

Figure 2 illustrates three alternative ways a trace may be routed to add propagation time to a signal line. In February's column, "Right-Angle Corners," I pointed out why alternative (b) is undesirable-it looks just like an antenna. Alternative (a) is even worse! It looks like a dish antenna. The preferred way to add propagation time to a trace is illustrated in (c), a randomly routed line. It may be a good idea to "guard band" such a trace to control crosstalk with other traces and to minimize susceptibility to radiated energy into the trace. 1MECL System Design Handbook, Motorola, 1988, p. 45, 48 and 129.

 

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